Ultrasonic Sieving Machines: Here’s What You Should Know

Ultrasonic Sieve System, Ultrasonic Sieving Machine

Ultrasonic sieving machines have made a significant mark in the world of particle separation. By harnessing the power of ultrasonic frequencies, these machines can sieve and separate particles with precision. However, newer sieving machines like the Hi-Sifter have emerged as technology advances, offering even superior capabilities. This article delves deep into the world of ultrasonic sieving machines, their comparison with the Hi-Sifter, and the advantages of the latter.

What is an Ultrasonic Sieving Machine?

An ultrasonic sieving machine uses ultrasonic frequency to vibrate the screen. This vibration frequency can reach up to 36,000 times per second, allowing fine powder materials to form a micro-suspended state on the screen. This ensures faster passage through the screen without generating static electricity or sticking, making it easier to screen powders.

When Were Ultrasonic Sieving Machines Invented?

Ultrasonic sieve machines, introduced around the 1970s, have remained relatively unchanged in design and function since their inception. While these machines offer a cost-effective entry point, they are often associated with high maintenance and repair costs over their lifespan. In the everchanging powder processing landscape where the demand for more precise particle cuts are required, the Ultrasonic sieve lags behind the more advanced sieving technologies such as the Hi-Sifter.

Hi-Sifter Industrial Sieve vs Ultrasonic Sieving Machine: A Comparative Analysis

As far as advanced sieving equipment technologies, the Hi-Sifter sieving machine stands out as a superior choice compared to its counterpart, the Ultrasonic Sieving Machine. But let’s face it, who doesn’t like to use the word “Ultrasonic,” right? Everything that has the word Ultrasonic next to it must mean that it’s far superior to anything that doesn’t have the ultrasonic word attached to it right? Well, let’s have a look and compare the two technologies and their capabilities:

Working Principle:

• Hi-Sifter: Employs high-frequency vibration to separate particles. The vibrations efficiently break down agglomerates and allow for precise sieving, 98%+ yields, high throughput rates even when sieving the finest of particles.
• Ultrasonic Sieving Machine: Uses an ultrasonic frequency that sends a pulse onto the screen surface, aiming to prevent screen clogging and facilitate particle separation.

Sieving Efficiency & Capabilities:

• Hi-Sifter: Known for its exceptional sieving efficiency, especially with ultra-fine powders. It can sieve particles as fine as 10um efficiently. In some instances, such as wet sieving, it can efficiently separate particles down to as fine as 5um. Moreover, the Hi-Sifter screen mesh does not blind, ensuring consistent performance throughout the entire screening process.
• Ultrasonic Sieving Machine: It offers decent sieving capabilities but can only sieve down to around 74um efficiently. Below these sizes, it has been said that Ultrasonics cannot make efficient separations over a prolonged period of time.

Applications:

• Hi-Sifter: Ideal for pharmaceuticals, food products, and other fine powders that tend to agglomerate and blind screen mesh of other screening machines. Its superior sieving capabilities make it a preferred choice for industries requiring precision. This is especially true for very dense metal powders, this is where the high acceleration energy of the Hi-Sifter really shines.
• Ultrasonic Sieving Machine: Suitable for a range of materials but might not be the best choice for ultra-fine powders.

Maintenance & Screen Changes:

• Hi-Sifter: One of the Hi-Sifters standout features is the ease of screen changes. It takes a mere 15 minutes, and operators can perform this task themselves. This quick changeover ensures minimal downtime between screen size changes.
• Ultrasonic Sieving Machine: Screen changes are a significant drawback. Screens often need to be sent back for redoing, which can be costly and time-consuming. According to some estimates, this can run anywhere from $2,000.00 to over $6,000.00 USD. Not only that but this process can leave a plant non-operational for weeks, leading to significant revenue losses.

Integration:

• Hi-Sifter: As a standalone unit, it can be seamlessly integrated into production lines, offering flexibility and efficiency.
• Ultrasonic Sieving Machine: While it can be integrated into new or existing sieving machines, it might not offer the same level of flexibility or efficiency as the Hi-Sifter.

Cost & Downtime:

• Hi-Sifter: Although it might have a higher initial investment, the reduced need for maintenance, quick screen changes, and superior sieving capabilities can offset the cost over time.
• Ultrasonic Sieving Machine: The additional costs associated with screen maintenance, coupled with potential downtimes, can make it a less economical choice in the long run.

What Are Some Common Issues People Face While Using Ultrasonic Sieving Machine?

Ultrasonic sieve systems have been a breakthrough in the particle separation industry, offering enhanced sieving capabilities. However, like all technologies, they come with their set of challenges. Considering this, here are several issues that come to the forefront from people that utilize this technology or plan to one day use this technology in their manufacturing process:

1. Screen Maintenance: One of the primary concerns with ultrasonic sieving machines is the need for frequent screen maintenance. Screens often need to be sent back for redoing, which can be both costly and time-consuming.

1. Downtime: The process of sending screens for maintenance can leave a plant non-operational for extended periods, leading to revenue losses.
2. Sieving Efficiency: While ultrasonic sieving machines can sieve down to around 74um efficiently, they might struggle with ultra-fine powders, especially when compared to advanced technologies like the Hi-Sifter.
3. Cost Implications: The initial investment for an ultrasonic sieving machine might be significantly less, however, the additional costs associated with screen maintenance and potential downtimes makes it much less economical in the long run.
4. Integration Challenges: While these machines can be integrated into new or existing sieving setups, they might not offer the same level of flexibility or efficiency as some of the newer sieving technologies available in the market.
5. Static Electricity and Sticking: Even though ultrasonic frequencies aim to prevent screen clogging, in some cases, fine powder materials might still generate static electricity or stick, and cause screen mesh blinding which hinders the throughput rates and sieving process over an extended period of time. The main issue that ultrasonic sieve machines face when it comes to blinding is that material is put onto the screen surface and it sits on the mesh while the ultrasonic pulse is activated. The mere act of the material sitting on the screen mesh causes the screen to blind. This is one of the key aspects of the Hi-Sifter that separates it from the Ultrasonic technology because the materials are never sitting on the screen surface which eliminates blinding all together and improves performance.

While ultrasonic sieving machines have revolutionized particle separation, the emergence of the Hi-Sifter has set a new benchmark in the powder screening industry. Its ability to sieve ultra-fine particles, combined with quick screen changes and reduced downtime, makes it an invaluable asset for industries seeking precision and efficiency. As technology continues to evolve, it’s essential for industries to stay updated and choose the equipment that offers the best return on investment and performance.